INTERMOLD Osaka 2026

[Heading] Shin Mold Success at INTERMOLD Osaka 2026: Next Destination – InterMold Thailand

【INTERMOLD Osaka Recap: Deepening Technology, Connecting the Globe】

From April 15th to 17th, 2026, Shin Mold Precision Industry Co., Ltd. officially debuted at INTERMOLD Osaka, the prestigious annual mold and die event held in Osaka, Japan.

During the three-day exhibition, Shin Mold showcased our latest breakthroughs in High-Pressure Die Casting (HPDC) and Precision Mold Development to industry experts from around the world. Through in-depth exchanges with international procurement specialists and technical developers, we have once again validated the strong market demand for high-quality tooling and production efficiency optimization.

We would like to extend our heartfelt gratitude to every partner and visitor who visited our booth (6B-212-6). Your valuable feedback is the core driving force behind our continuous innovation and pursuit of excellence.